SMT Reflow Soldering Oven Advantages
Solder paste is a mixture of flux and powdered solder. The process of attaching electrical components to the contact pads is called reflow soldering. During this process, the controlled heat within SMT reflow soldering oven melts the solder, to connect the joints permanently. Special models are designed to meet high thermal requirements and fine mesh belts for miniature parts.
These devices are generally used for different surface mount components. Using smaller, energy efficient and compact models provides reduced assembly costs. Computer controlled heat won't cause any damage to even the most sensitive parts. The whole process consists of at least four different stages, or more.
In the first stage, often called the preheat zone, the solvent in the paste begins to evaporate. In thermal soak zone the fluxes are temporarily attached. In the third stage, also called the reflow zone, the maximum temperature is reached. This temperature depends on the component with the lowest tolerance on high temperature.
Cooling zone is important part of the process. In this stage, the board is gradually cooled, and the joints are solidified. A cooling rate depends on components sensitivity as well. Generally, the rate of four degrees of Celsius per second is the most commonly used. Cooling rates have a significant effect on solder joint grain structure.
SMT reflow ovens are mostly categorized in mid to high volume devices, bench top models and nitrogen ovens. They are all designed to provide at least the same performance level compared to standard devices used for this purpose, but they do take up less space and provide very good performance.
Mid to high volume devices have four independent reflow zones, several thermocouple inputs and LCD touchscreen controls. This type of devices is often used for testing and prototyping. Their stainless steel mesh conveyor accepts up to twenty inch wide boards, and the combination conveyor provides maximum handling flexibility.
On-board computer permits on-screen profiling, and the parameters are set automatically. Particular parameters can be saved to a memory, and reloaded when needed. When re-loaded, all parameters can be additionally adjusted, including upper and lower limits, specific zones temperature settings and conveyor speeds.
These compact sized models provide very good efficiency, easy handling and low consumption of energy. Advanced thermal management options and other innovative possibilities are making them very useful in all types of industries. Safety systems include audible and visual alarms and automatic shutdown options.
Larger SMT ovens provide up to ten controlled upper and lower full-convection heating zones. They provide maximum functionality, automatic hood-life mechanism and high precision conveyor mechanism. This is a reliable solution for all medium and high volume manufacturers. It combines high mass heat sources with efficient thermal heat transfer, ensuring very good process stability.
Different types of SMT reflow soldering oven with pin over mesh conveyor system meet any production requirement. Pin conveyors permit inline and double-sided processing. All components are built of high quality stainless steel, to maintain dimensional tolerances at the high temperature lead-free processing. All systems are equipped with special battery backup.
These devices are generally used for different surface mount components. Using smaller, energy efficient and compact models provides reduced assembly costs. Computer controlled heat won't cause any damage to even the most sensitive parts. The whole process consists of at least four different stages, or more.
In the first stage, often called the preheat zone, the solvent in the paste begins to evaporate. In thermal soak zone the fluxes are temporarily attached. In the third stage, also called the reflow zone, the maximum temperature is reached. This temperature depends on the component with the lowest tolerance on high temperature.
Cooling zone is important part of the process. In this stage, the board is gradually cooled, and the joints are solidified. A cooling rate depends on components sensitivity as well. Generally, the rate of four degrees of Celsius per second is the most commonly used. Cooling rates have a significant effect on solder joint grain structure.
SMT reflow ovens are mostly categorized in mid to high volume devices, bench top models and nitrogen ovens. They are all designed to provide at least the same performance level compared to standard devices used for this purpose, but they do take up less space and provide very good performance.
Mid to high volume devices have four independent reflow zones, several thermocouple inputs and LCD touchscreen controls. This type of devices is often used for testing and prototyping. Their stainless steel mesh conveyor accepts up to twenty inch wide boards, and the combination conveyor provides maximum handling flexibility.
On-board computer permits on-screen profiling, and the parameters are set automatically. Particular parameters can be saved to a memory, and reloaded when needed. When re-loaded, all parameters can be additionally adjusted, including upper and lower limits, specific zones temperature settings and conveyor speeds.
These compact sized models provide very good efficiency, easy handling and low consumption of energy. Advanced thermal management options and other innovative possibilities are making them very useful in all types of industries. Safety systems include audible and visual alarms and automatic shutdown options.
Larger SMT ovens provide up to ten controlled upper and lower full-convection heating zones. They provide maximum functionality, automatic hood-life mechanism and high precision conveyor mechanism. This is a reliable solution for all medium and high volume manufacturers. It combines high mass heat sources with efficient thermal heat transfer, ensuring very good process stability.
Different types of SMT reflow soldering oven with pin over mesh conveyor system meet any production requirement. Pin conveyors permit inline and double-sided processing. All components are built of high quality stainless steel, to maintain dimensional tolerances at the high temperature lead-free processing. All systems are equipped with special battery backup.
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